Ultra Fine Grain Low Melt 148C Solder Paste PoP Stack BGA Nand T2 iPhone Samsung For Sale

Ultra-Fine Grain (4.3# / Type 5) – Perfect for precision stencils (iPhone NAND, baseband, MacBook T2, etc.). Smooth fills without clogs like cheaper XG pastes.

Low-Temp Formula (148 °C) – Reduces board stress during reball/reflow. Ideal for sensitive multilayer PCBs and data recovery work.

Bright, Reliable Joints – No cold joints, no false welds. Produces clean, consistent solder balls every time.

Proven Quality – Genuine MECHANIC paste. This isn’t the crusty counterfeit stuff floating around — fresh U.S. stock, ready to ship.

Brand: MECHANIC

Model: XP5

Net Weight: 42 g jar

Grain Size: 4.3# Microns (≈ Type 5)

Alloy: Unleaded, low-temp formula

Melting Point: 148 °C

Applications: iPhone/iPad NAND & baseband reball, MacBook logic boards, BGA GPU/CPU rework, fine-pitch SMT soldering.

Storage: Keep sealed at 0–10 °C for longest shelf life.

Use in a well-ventilated area.

Avoid contact with skin or eyes.

Do not ingest. Keep away from food and pets.