Epoxy Potting Compound 4 Large & Thick Pours -Low Exotherm Thermally Conductive For Sale

MAX EPC A/BElectronic Potting CompoundSlow Setting Epoxy Resin For Large Casting, Potting, Encapsulating44 Fluid Ounces Combined Volume32 Fluid Ounces Of Resin12 Fluid Oz Curing Agent(Larger 89-FL.Ounce Kit Size Mix Ratio By Weight
Due To Considerable Difference In Density Between Resin (PART A) And Curing Agent (PART B),
Each Component Must Be Weighed To Ensure Proper Cure.Premix MAX EPC PART A -RESIN
Before Adding
MAX EPC PART B -CURING AGENT
PRODUCT DESCRIPTION
MAX EPC A/B is room temperature cured epoxy-based electronic potting compound designed for large mass encapsulation of printed circuit boards.
It produces low exothermic heat suitable for large mass or thick cross-section potting and casting applications. Upon cure, MAX EPC creates a permanent barrier against ambient air, corrosive environments, moisture and directphysicalcontact with the circuitry.
MAX EPC demonstrates excellent dimensional stability with minimal thermal expansion and contraction.
MAX EPCcan be poured up to 4-inch thick sections and will not generate high exothermic heat during cure.It cures very hard after 36 hours at 25°C (77°F)or can be heat cured for faster cure times.MAX EPC A/Boffers high thermal conductivity that dissipates heat away from the circuitry, preventing 'hot spots' that can cause component failure or reduced life span of the encapsulated electronic circuit.
MAX EPC A/B bonds to metals, FRP, ABS, PVC, Plastisol, and other substrates commonly used in wire jackets, circuit boards and electrical enclosures.MAX EPC A/B yields low shrinkage and excellent dimensional stability that prevents 'component pull-outs' caused by expansion and contraction coefficients when exposed to varying temperatures.Its service temperature ranges from -40°C to 100°C (-40°F to 250°F).

MAX EPC A/B is mixed 4:1 by weight; it provides greater than 90-minute working time for volumes of 4 cubic inches and up to 45 minutes for larger mass -6 cubic inches. Its mixed viscosity is 2100 cPs at 25°C, similar to the consistency of corn syrup or honey, and easily poured in place.
It is self-leveling and designed to release air bubbles and cure with minimal voids and porosity.

Upon cure, MAX EPC A/B permanently encapsulates the circuitry in an electrically non-conductive resin matrix that prevents any direct contact with the electronics.It is entirely waterproof and is suitable for continuous water immersion or ground buried potting applications.

For Encapsulating Electronic Parts And Circuit Boards
Watch the video demonstration above for potting and embedding electrical circuitry.

Click Play To View Video Demonstration

EPOXY POTTING COMPOUND POURING LARGE VOLUMES - MAX EPC A/B - YouTube

• Prepare the circuit board to be potted.
• The circuit board should be clean and solder flux is removed to ensure a good bond.
• Use spray flux remover to clean the printed circuit board before embedding in the MAX EPC A/B.
  Allow the solvent flux remover to dry thoroughly before potting.
• Pre arrange the wire leads to the desired position and secure.
• Premix the contents of the MAX EPC Part A to redisperse any settling of the dense filler.
• In a clean mixing container, weigh the PART A and Part B at a 4:1 mix ratio.
• Mix gently to minimize air entrapment until the components are well blended to a uniform consistency.
  Pay close attention to the bottom and edges of the mix container
• Poor and inadequatemixing will cause uncured or tacky spots to appear.
• Pour the mixture into another clean container and mix for another minute.
  This will ensurea thoroughly mixed resin is achieved and ensure a full cure.
• Pour the mixed MAX EPC into the parts housing to be encapsulated ensuring complete and level coverage.
• Dispense from one corner of the component casing and allow the material to completely flow and fill the casing and encapsulatethe circuit. View the video demonstration link below.
  This technique will reduce voids and air entrapment.

GENERAL CURING
Place on a level surface. The MAX EPC mixture is self-leveling.Allow the potted part to cure at room temperature between 20°C to 30°C for 24 to 36 hours.To mitigate temperature variation due to seasonal change, place the MAX EPC A/B kit bottles at a controlled 25°C ambient temperature for 4 hours to regulate the cure speed and fabrication process.MAX EPC may take longer to cure and thicker at lower temperatures, 17°C and faster at temperatures above 30°C.See the table below for the accelerated curing schedule.If available, use a Durometer to determine the cured hardness; a reading of 65 D will be sufficient for handling. To check handling properties, attempt to indent the application using your fingernail. It can safely be handled for the next fabrication step if it does not produce an indent.MAX EPC continues to cure until the final Shore Hardness is 80D to 85D.

PHYSICAL PROPERTIES

Viscosity PART A -Resin

8,000-8,200 cPs at25 °C

Viscosity PART B –Curing Agent

180-250 cPs at25 °C

Density PART A -Resin

1.57 GramsPer Cubic Centimeter

Density PART B –Curing Agent

0.95 GramsPer Cubic Centimeter

Mix Ratio By Weight

100 Parts A to 25 Parts B (4:1) By Weight

Mixed Viscosity

3,850 to 4,100 cPs at25 °C

Mixed Color

Opaque Black

Mixed Density

2.10 g/cc

Working Time

120 Minutes (500-Gram Mass)

Peak Exotherm

90°CMax (500-Gram Mass)

Cure Schedule

8 Hours Dry To The Touch @25°C

96 Hours Full Cure Time At 25°C

Accelerated Cure

Allow To Cure For 3 Hours @ 25°CThen Post Cure at120°Cfor 2 Hours

MECHANICAL PROPERTIES

Shore Durometer Hardness

85 Shore D

Dimensional Shrinkage

Less Than 0.20 % Upon Full Cure

Compressive Strength

13,800 psi

Tensile Strength

9,900 psi

Tensile Elongation

4% Maximum

Thermal Conductivity

2.36- 2.5 W/mK

Maximum Operating Temperature

110°C

ELECTRICAL PROPERTIES

Volume Resistivity

4.7 X 1015Ohms-Cm

Dielectric Strength-60 Cycles

500 Volts/Mil

Dielectric Constant

4.0 (10 kHz)

Dissipation Factor

.014 (10 kHz)

Click Play To View Video Demonstration

EPOXY POTTING COMPOUND POURING LARGE VOLUMES - MAX EPC A/B - YouTube

General Mixing Instruction For Epoxy Resins
Avoid Tacky Cure Due To Poor Mixing
This video demonstration is suitable for any two-component epoxy resin system.
The resin system used in the video is different than the MAX EPC.
However, it demonstrates the best method for mixing multi-component resin systemsThis procedure avoids unmixed or partially mixed resin from the potting application.
Click Play To View Video Demonstration

How To Mix Epoxy Resin For Food Contact Coating. Avoid Tacky Spots, Minimize Air Bubble When Mixing - YouTube

Video will open in a new window

For Encapsulating Electronic Parts And Circuit Boards

• Watch the video demonstration above for potting and embedding electrical circuitry.
  Prepare the circuit board to be potted.
• The circuit board should be clean and solder flux is removed to ensure a good bond.
• Use spray flux remover to clean the printed circuit board before embedding in the MAX EPC A/B.
  Allow the solvent flux remover to dry thoroughly before potting.
• Pre arrange the wire leads to the desired position and secure.
• Premix the contents of the MAX EPC Part A to redisperse any settling of the dense filler.
• In a clean mixing container, weigh the PART A and Part B at a 4:1 mix ratio.
• Mix gently to minimize air entrapment until the components are well blended to a uniform consistency.
  Pay close attention to the bottom and edges of the mix container
• Poor and inadequatemixing will cause uncured or tacky spots to appear.
• Pour the mixture into another clean container and mix for another minute.
  This will ensurea thoroughly mixed resin is achieved and ensure a full cure.
• Pour the mixed MAX EPC into the component housing to be encapsulated ensuring complete and level coverage.
• Dispense from one corner of the component casing and allow the material to completely flow and fill the casing and encapsulatethe circuit. View the video demonstration link below.
  This technique will reduce voids and air entrapment.
  

  RoHS CompliantConflict-Free Minerals

  IMPORTANT NOTICE

  Your purchase signifies your acceptance of this disclaimer.
  Please review it carefully before proceeding with the purchase of this product.

  The user should thoroughly test any proposed use of this product and independently conclude that it performs satisfactorily in the application.
  Likewise, if the way this product is used requires government approval or clearance, the user must obtain said approval.

  The information contained herein is based on data believed to be accurate at the time of publication. Data and parameters cited have been obtained through published information, Polymer Composites Inc. laboratories using materials under controlled conditions. However, it is the user's responsibility to determine the product's fitness for use. Data of this type should not be used for fabrication and design specifications.

  There is no warranty of merchantability for fitness of use, nor any other express implied warranty. The user's exclusive remedy and the manufacturer's liability are limited to the refund of the purchase price or replacement of the product within the agreed warranty period. Polymer Composites, Inc. and its direct representative will not be liable for incidental or consequential damages of any kind. Determination of the suitability of any information or product for the use contemplated by the user, the manner of that use, and whether there is any infringement of patents is the sole liability of the user.