Epoxy Potting Compound 4 PCB -Insulate Mask Seal & Waterproof All Circuits AC/DC For Sale

MAX MCR A/B

POTTING RESIN FOR ELECTRONICCIRCUITBOARDS

48- FLUID OUNCES COMBINED VOLUME

1 Quart Of Resin (32 Fluid Ounces)

And

1 Pint Of Curing Agent (16 Fluid Ounces)

PRODUCT DESCRIPTION

MAXMCR BLACK A/Bis an unfilled medium working time, low viscosity potting compound resin system for embedding or encapsulating printed circuit boards (PCB), relays, coils, and other electronic or electrical circuitry. MAX MCR A/Bis low in viscosity and is room temperature cured. It is mixed 2:1 by weight or by volume and provides a 30 minute working time (200-gram mass @ Upon cure, MAX MCR is completely noon electrically conductive offers a very high gloss finish blemish free surface. It cures to a hard but tough compound that is suitable forsmall to medium parts without excessive exothermic heat generation (up to 1 pound). It has a 30-minute working time when mixed up to 200-gram mass.

The2 to 1 mix ratio offers ease of useand easily poured in place or can be adapted for mix meter equipment.

MAX MCR A/B bonds to PVC, PP, ABS, Plastisol, aluminum, steel, copper, brass and other materials typically used in electrical circuits.

RoHS & REACH Conflict Minerals Compliant

Electrical Insulating And Potting Of Electronic Circuitry

Permanent Opaque Black Masking Compound For Proprietary Electronics

Electrical Potting Compound

Embedding Or Masking Compound

Waterproof Low To High Voltage Circuit

Electrical Insulating And Potting Of Electronic Circuitry

Permanent Opaque Black Masking Compound For Proprietary Electronics

Circuit Board Conformal Coating

Electrical Potting Compound

Waterproof For ContinuousSalt Or FreshWater Immersion

Low To High Voltage- AC/DC Circuit

Direct Cast (No Box Enclosure) LED Driver Circuit Board Potting Using Silicone Mold

Form And Color

Black Liquid, Self Leveling Other Colors Available

Viscosity Part A

2,500 cPs@75°F

Viscosity Part B

750 cPs@75°F

Mixed Viscosity

1,950 cPs@75°F

Mix Ratio By Weight

(2:1) 100 Parts A to50 Parts B

Mix Ratio By Volume

(2:1)100 Parts A to50 Parts B

Mixed Density

1.10 g/cc

Working Time

30 minutes (400-gram mass)

Gel Time

60 minutes@75°F

Peak Exotherm

280°Fmax (400-grams)

Demold Time

24 hours room temperature@75°F

Accelerated Cure

2 Hours @75°F

+30 minutes @200°F

Shore Hardness

75 Shore D

Shrinkage:

<0.30 %

Compressive Strength

13,800 psi@75°F

Tensile Strength

9,900 psi@75°F

Tensile Elongation

4%@75°F

Heat Distortion Temperature

190°F

ELECTRICAL AND THERMAL CONDUCTIVITY PROPERTIES

Volume Resistivity

4.7 X 1013Ohms-Cm

Dielectric Strength

510 Volts/Mil 60 Cycles

Dielectric Constant

4.0 (10 kHz)

Dissipation Factor

0.014 (10 kHz)

Thermal Conductivity (Unfilled) 40°-45°C

0.25 W F/mK

CHEMICAL RESISTANCE PERFORMANCE
FULL IMMERSIONAT 25°C
MEASURED PERCENT CHANGE IN WEIGHT

Reagent

10 days

28 Days

Deionized Water

0.03 %

0.03 %

Sea Water

0.01 %

0.08 %

Methanol

0.93 %

2.41 %

Ethanol

1.98 %

1.28 %

Toluene

0.40 %

2.86 %

Xylene

0.04 %

0.05 %

Gasoline (E85 Blend)

0.20 %

0.23 %

Dimethyl Formamide

Destroyed

Destroyed

10% Lactic Acid

0.81 %

1.42 %

10% Acetic Acid

0.11 %

0.45 %

70% Sulfuric Acid

0.08 %

0.14 %

50% Sodium Hydroxide

0 %

0.1 0%

10% Sodium Hypochlorite

0.51 %

0.96 %

MAX MCR A/B Available Kit Sizes

48-Fluid Ounce Combined class="MsoNormal" align="center" style="font-family: Arial; text-align: center;">96-Fluid Ounce Combined class="MsoNormal" align="center" style="font-family: Arial; text-align: center;">192-Fluid Ounce Combined align="center" class="MsoHeader" style="font-size: 14pt; font-family: Arial; white-space: normal; margin: 0in 0in 0pt; text-align: center;">High-pressure Sensors Potted With

MAX MCR A/B

24 Volt Solenoid Valve Potted With MAX MCR A/B

Tested To >2,000,000 Cyclic On/off Test With No Failure

.

Circuit Board Potting With MAX MCR A/B

Waterproofing Of An Electrical Circuitry

Click The Picture To View The Video

MAX MCR A/B POTTING AND ENCAPSULATION

MAX MCR A/B used as the black PCB potting compound.

The clear resin used as the LED encapsulant is our MAX DIAMOND CLEAR,

a cycloaliphatic epoxy resin that is resistant to damage and yellowing from the UV energy produced by the LED light.Itdemonstrates excellent transparency and color stability suitable for LED encapsulation.

CRYSTAL CLEAR LED BULB ENCAPSULANT

Continuous Salt Water Immersion LED Dock Marker Lights

EPOXY RESIN MIXING AND USAGE APPLICATIONS

Please view the following video for the proper mixing of epoxy resins.
It demonstrates the proper technique of mixing any type of epoxy resin.

Best Epoxy Resin Mixing Procedure
Avoid Tacky Spots & Less Air Bubble
Improve Cure Performance

How To Mix Epoxy Resin For Food Contact Coating. Avoid Tacky Spots, Minimize Air Bubble When Mixing - YouTube

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Using the App? Paste link into a browser window:

EPOXY RESIN MIXING AND THICK CASTING TROUBLE-FREE TECHNIQUE MAX MCR A/B RESIN SYSTEM - YouTube

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PLEASE CHECK OUT OTHER AVAILABLERESIN SYSTEMS AT OUR store

IMPORTANT NOTICE

Your purchase constitutes the acceptance of this disclaimer. Please review before purchasing this product.
The user should thoroughly test any proposed use of this product and independently conclude that it performs satisfactorily in the application. Likewise, if the way this product is used requires government approval or clearance, the user must obtain said approval.

The information contained herein is based on data believed to be accurate at the time of publication. Data and parameters cited have been obtained through published information from Polymer Composites Inc. laboratories using materials under controlled conditions. However, it is the user's responsibility to determine the product's fitness for use. Data of this type should not be used for fabrication and design specifications.

There is no warranty of merchantability for fitness of use, nor any other express implied warranty. The user's exclusive remedy and the manufacturer's liability are limited to the refund of the purchase price or replacement of the product within the agreed warranty period. Polymer Composites, Inc. and its direct representative will not be liable for incidental or consequential damages of any kind. Determination of the suitability of any information or product for the use contemplated by the user, the manner of that use, and whether there is any infringement of patents is the sole liability of the user.